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The joining of copper to aluminum is inevitable for certain application in the electrical industry due to good conductivity and response offered by copper, aluminum for weight reduction. Whilst in the majority of cases, aluminum and copper can be joined by adhesive bonding, mechanical fastening, fusion welding and solid-phase welding techniques. Friction welding is well known for its ability to weld...
As the temperature increases, interconnect delay increases due to the linear increase in electrical resistivity. This degrades the performance and shortens the interconnects life time. Package reliability will also be severely affected by the resulting thermal hotspots, thus impacting the overall performance of multicore systems. We approach this challenge by proposing to use thermal management techniques...
By launching new processes introduced by nano science into much more conventional industrial applications fast, robust and economical reasonable inspection methods are required for process control and quality assurance. Due to the complexity of processes e.g. for thin film coatings or nano engineered materials, variations of material parameters like microstructures, grain boundary conditions, particle...
New guiding structure for millimeter-wave integrated circuits was proposed in this paper. Since surfaces of dielectric substrates for printed boards are usually roughened to make tight copper-coating, it was found out that effective conductivities of surfaces of the copper foils, attaching on the dielectric substrate, more degraded than those of the opposite surfaces of the copper foils, facing an...
In this paper, the conductivity of a copper-clad cyclo olefin polymer (COP) substrate and PTFE substrates with two types of copper clad in the millimeter wave region was accurately evaluated. The roughness of the contact between the copper and dielectric could degrade the conductivity of the copper equivalently, which increases loss. The evaluation of complex permittivity in a dielectric substrate...
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