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The performance of integrated circuits has been growing exponentially, which has resulted in the development of a variety of VLSI products for communications, computers, and medical applications. The increase in the performance is mainly due to the decrease in the dimensions of the integrated circuit chip. To sustain this improvement, the industry has to overcome several technological challenges in...
In this paper we study the high-frequency effects due to the presence of drivers, repeaters and loads along an intermediate/global interconnects made of a densely-packed carbon nanotube (CNT) bundle, comparing the results with those obtained for an ideally-scaled Cu-based interconnect. The CNT interconnect is described by means of a multiconductor transmission line in cascade with suitable lumped...
The paper presents recent advances in carbon nanotube interconnect modeling, with focus on their application to nanoscale chip packaging. An enhanced electrical model of carbon nanotube bundles is used, able to take into account the effects of different nanotube sizes covered by this application. The use of carbon nanotubes as chip to package interconnects at nanoscale dimensions is analyzed and the...
The crosstalk effects in single- and double-walled carbon nanotube bundle bus architectures are investigated and compared in this paper. New equivalent circuit models are proposed for both the single- and double-walled carbon nanotube bundles. It is found that (a) compared to single-walled carbon nanotube (SWCNT) bundle, a double-walled carbon nanotube (DWCNT) bundle bus can lead to a reduction of...
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