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We have developed a strain gauge sensor to measure two axial dynamic strain and temperature evolution during ultrasonic flip-chip bonding. The sensor detects strain from change in resistance due to the piezoresistance effect of Si and temperature from change in current-voltage characteristics of pn-junction. The spatial resolution of the sensor is 20 µm. Au planar microbumps were used for the measurement...
The bonding quality as obtained by strength tests of thermosonic bonding has been investigated as function of bonding temperature and ultrasonic power. The results show that bonding quality is very sensitive to process temperature and power. Optimum bonding temperature is not identical at different ultrasonic power. Analogously, optimum ultrasonic power which appears between 0.36 W and 0.95 W is not...
Thermoelectric properties of ternary silver thallium tellurides: Ag8T12Te5 and AgT13Te2 were studied above room temperature to slightly below the melting temperature. As for Ag8T12Te5, the effects of Te content on the thermoelectric properties were also studied by characterizing the samples of Ag8T12Tex (x = 5.0, 5.1, 5.2). Both compounds show positive Seebeck coefficient (S). Ag8T12Te5 indicates...
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