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Integrated circuits (ICs) undergo dimensional reduction and the functional unit of density dramatically increases, the reliability issue becomes more critical, especially with respect to three-dimensional (3D) silicon integration technology. Through-Silicon Vias (TSVs) technology is one of the most prominent feature used for interconnecting between chips. Since TSVs contain interfaces of heterogeneous...
New electronic devices with small size and low power consumption are in demand in recent years. Miniaturization and complex product are required in modern electronics for more functionality in the smaller electronic package. To overcome such issues, 3D packages or package on package (PoP) are introduced. The 3D packaging is stacking of chip on top of another which is emerging as a powerful technology...
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