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The Godson-3 microprocessor aims at high-throughput server applications, high-performance scientific computing, and high-end embedded applications. It offers a scalable network on chip, hardware support for x86 emulation, and a reconfigurable architecture. The four-core Godson-3 chip is fabricated with 65-nm CMOS technology. Eight- and 16-core Godson-3 chips are in development.
The SMILE project attempts to build efficient lowcost clusters based on FPGA boards using their reconfigurability capabilities. A real parallel application of Content-Based Information Retrieval over the SMILE cluster is presented. Using this application the SMILE cluster??s performance is evaluated and compared in terms of time and power consumption with traditional cluster architecture.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.