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Through-silicon-vias (TSVs) processes, which provide direct electrical paths between chips which results in shorter interconnect length, improved performance and better power efficiency, have been intensively investigated for vertically-stacked 3D semiconductor devices. Low-k materials have been considered in the literature for the insulation layer of the TSV interconnection since its low dielectric...
Organic low-$k$ materials have been considered in the literature for satisfying the requirements of lowering the dielectric constant of the dielectric layer to decrease the problem of signal delay, lower power consumption, and to reduce cross talk between the neighboring paths, and lowering the fabrication temperature budget. In this paper, the feasibility of using Parylene-HT as a low-temperature...
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