The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper investigates two key aspects of thermomechanical reliability of through-silicon vias (TSV) in 3D interconnects. One is the piezoresistivity effect induced by the near surface stresses on the charge mobility for p- and n- channel MOSFET devices. The other problem concerns the interfacial delamination induced by thermal stresses including the pop-up mechanism of TSV with a `nail head'. We...
As the market demands for high performance, miniaturized, better reliability and lower-priced portable electronic products, the integration of a system into three-dimensional (3D) chip stacking packages are presently used to achieve these targets. Even though the miniaturization of system scaling, low power consumption and better electrical performance can be performed by 3DIC packaging technologies,...
In 3-D interconnect structures, process-induced thermal stresses around through-silicon-vias (TSVs) raise serious reliability issues such as Si cracking and performance degradation of devices. In this study, the thermo-mechanical reliability of 3-D interconnect was investigated using finite element analysis (FEA) combined with analytical methods. FEA simulation demonstrated that the thermal stresses...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.