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Laser sintering technology is being widely applied in different industries. There is, however, a resistance to the application of this technology and the applications are limited due to the nature of the process. For example, the surface roughness of the final laser sintered product is often a major technical issue. The disadvantages in one area can probably displayed as the advantages in another...
A theoretical model is proposed in this work for an evaluation of the specific heat and Debye temperature of thin-film semiconductors. In the model, the specific heat contributed by the confined acoustic phonons is calculated first. An effective Debye temperature is then defined by fitting the conventional Debye model to the calculated specific heat. It is found that the so-defined Debye temperatures...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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