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Heat‐shrinkable films commonly serve as active materials for self‐folding owing to their capability to fold all hinges upon heating. For origami‐based electronic devices, the self‐folding of the metal layer is necessary. Nevertheless, the self‐folding angle is low owing to the high bending stiffness of metal layers and the low adhesion of heat‐shrinkable films. Here, we introduce a bilayer self‐folding...
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