Self‐assembled poly(amide amine)‐copper (PAMAM/Cu) film on silicon was prepared and investigated by means of contact angle measurement, XPS and atomic force microscopy (AFM). The tribological properties were evaluated using a reciprocal ball‐on‐disc test rig and a lateral force microscope. Results of XPS show the existence of Cu(0) and PAMAM molecule on the surface of the film. Compared with the self‐assembled monolayer of the poly(amide amine) generation 4.0 dendrimer, the friction force of PAMAM/Cu film is lower and the friction coefficient is smaller which can be attributed to the existence of Cu nanoparticles. The PAMAM/Cu film shows a good lubrication effect. The stability of friction and wear resistance of film is improved. Copyright © 2011 John Wiley & Sons, Ltd.