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This study demonstrates that plasma‐enhanced chemical vapor deposition of copper films can be achieved in ambient air and at low temperature. A helium dielectric barrier discharge jet with a small mixture of hydrogen and copper(II) acetylacetonate vapor is utilized as the nonthermal plasma source to deposit conductive copper films with low electrical resistivity (<1 × 10−7 Ω·m). The deposited film...
This work examines the combination of pulsed direct‐liquid injections with dielectric barrier discharge at atmospheric pressure for the deposition of organosilicon coatings using hexamethyldisiloxane (HMDSO) as the precursor and nitrogen as the carrier gas. In such conditions, deposition relies on the charging of micrometer droplets and their transport toward the substrate by the Coulomb force. The...
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