Pure tin oxide (TO) films are deposited onto glass substrates at various substrate angles relative to the source position by a simple and inexpensive method of atmospheric pressure (AP)CVD. The deposition temperature is constant at about 500°C, and oxygen with a flow rate of 100 sccm is used as both the carrier gas and the oxidizing agent. Investigation of the sheet resistance shows that resistivity varies between 106 and. 241 Ω/□. X‐ray diffraction (XRD) also reveals that the structure is polycrystalline with the preferred orientation of (110) for all films deposited at the various substrate angles. Scanning electron microscopy (SEM) images also reveal a uniform and impacted structure on the surface of all the films. Optical properties show clear changes as a result of the substrate position versus the source.