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On page 8371, J.‐H. Kim, K. J. Lee, and co‐workers demonstrate simultaneous roll transfer and interconnection of Si‐based flexible NAND flash memory (f‐NAND) based on continuous roll‐to‐plate packaging. The f‐NAND operates with excellent flexibility and stable interconnections. This method has the potential of integrating Si‐based high‐performance large‐scale integrated circuits (LSIs) on plastics...
Ultrathin silicon‐based flexible 16 × 16 NAND flash memory (f‐NAND) is demonstrated utilizing roll‐to‐plate packaging. The roll‐based thermo‐compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f‐NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f‐NAND is confirmed with excellent flexibility and stable ACF interconnections...
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