The effect of irradiation of copper films with low-energy He2+ ions on their structural properties has been studied. The surface morphology and structural properties of the samples before and after irradiation have been examined by scanning electron microscopy, energy dispersive analysis, and X-ray diffraction. Bombardment of the initial samples with He2+ ions at a fluence of 1 × 1016ion/cm2 alters the surface morphology of copper films and leads to the formation of nanoscale inclusions of hexagonal shape. An increase in the fluence to 1 × 1017 ion/cm2 and higher results in the formation of cracks and amorphous oxide inclusions on the sample surface.