With development of miniaturization, high integration, multifunction and high efficiency of electronic packaging technology, a higher requirement for soldering material and its enlistment property is needed. It is easily subjected to reliability failure for electronic products or components packaged with micro/nanoelectronic packaging technology. In this paper, research process and some typical failure mechanisms on interconnect solder point reliability are discussed, including electro-migration (EM), thermal migration (TM), K-cavity, corrosion, electrochemical migration (ECM) and whisker growth, etc. It provides the basic data for the new generation of micro/nano-packaging technique to improve the fine-pitch jointing reliability.