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Formation of spurious grains during directional solidification (DS) of Al-7 wt.% Si and Al-19 wt.% Cu alloys through an abrupt increase in cross-sectional area has been examined by experiments and by numerical simulations. Stray grains were observed in the Al-19 wt.% Cu samples and almost none in the Al-7 wt.% Si. The locations of the stray grains correlate well where numerical solutions indicate...
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