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Electrodeposited Co(P) layers with three different P contents (0.5 wt.%, 0.8 wt.%, and 2 wt.%) have been coated on Cu substrates by adding minor amounts of sodium hypophosphite to the Co plating bath. These hcp-Co(P) coatings exhibited highly preferred (002) orientation. Solid-state interfacial reactions of 6-μm-thick Co(P)/Cu with pure Sn were conducted at temperatures of 160°C to 210°C. In the Sn/Co-0...
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