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We have investigated the effect of small amounts of Cu on suppression of metastable βSn-NiSn4 eutectic growth in solder joints between Sn-3.5Ag-xCu solders and Ni-based substrates. For Sn-3.5Ag/electroless nickel immersion gold (ENIG) and Sn-3.5Ag/Ni solder joints we showed that the eutectic mixture contains βSn, Ag3Sn, and metastable NiSn4. It was found that addition of only 0.005 wt.% Cu to Sn-3...
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