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In this paper the creep behavior of lead-free 96.5Sn-3.0Ag-0.5Cu solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs has been conducted. The tests were observed in situ with a high-magnification camera system. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding,...
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