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Single shear-lap specimens having a solder joint area of 1 mm2 and nominally 100-µm thickness on copper substrates were crept at 85°C and compared to dual shear-lap specimens with copper and nickel interfaces that were thermomechanically cycled from −15°C to 150°C to mimic the solder-joint deformation history of surface-mount components. Electron microscopy revealed surface cracks in some grain boundaries...
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