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We developed 3.3kV All-SiC power module on which SiC-MOSFET and SiC-SBD were mounted for electric power distribution apparatus. This power module has characteristic structure of pin-connections and resin-molded. Total switching loss of the module is lower than the module which mounted Si-IGBT and Si-FWD more than 60 percent.
The ultrasonic wire bonding has been applied in the semiconductor packaging industry ever since its innovation in the 1960s. The mechanisms of the bonding process, however, are still unclear. According to state-of-the-art, the extremely short bonding process can be divided into four phases. These phases at the bonding interface were analyzed either from a side view or from a 2-D view but only after...
With the rapid growth in the mobile industry, Package-on-Package (PoP) technology has been widely adopted for the 3D integration of logic and memory devices within mobile handsets and other portable multimedia products. The PoP solution offers significant advantages, including increased density through stacking logic and memory devices in the same formfactor and a high degree of flexibility for variable...
Drop test for solder joint reliability is critical for all area arrays and perimeter-leaded surface mount semiconductor devices typically used in handheld electronic products. Joint Electron Device Engineering Council, JEDEC, published a new test standard, JESD22-B111A, to be the revision of the JESD22-B111 for board level drop test in November, 2016. The major differences between JESD22-B111 and...
We present a low loss connector optimized for multimode polymer waveguides. The results show a demonstrator using polymer waveguides with a square cross section which were coupled to glass MM fiber with average loses of 0.5 dB per connector and over 100 matching cycles without degradation.
L-CRIGF consists of a grating coupler in a waveguide cavity. Four tandem L-CRIGFs of different wavelengths were designed and fabricated. Wavelength selective reflections and simultaneous couplings to a single output waveguide were confirmed experimentally.
A Full 25GB/S silicon photonics platform is described in this paper, and new technological challenges that aim to improve this platform, such as multiple silicon levels, silicon nitride levels, edge coupling processing or integration of heterogeneous materials to enable tunable integrated lasers, are discussed.
Currently, optically reconfigurable gate arrays have been being developed for space radiation environment applications. An optically reconfigurable gate array consists of a holographic memory, a laser array, and an optically reconfigurable gate array VLSI. The optically reconfigurable gate array is a type of field programmable gate arrays (FPGAs). The radiation tolerance of the optically reconfigurable...
We have proposed a power supply circuit and an electrical interconnect test method based on charge volume supplied from the power supply circuit. We optimize the supply circuit so as for small resistive open defects that occur at interconnects among dies in 3D stacked ICs to be detected by the test method. We examine what resistive open defects can be detected with the optimized power supply circuit...
The presence of common-mode noise in differential lines is a major contributor to signal integrity problems in high-speed digital systems. Common-mode noise is typically excited by skew. It can occur due to timing mismatches at the driver, length mismatches due to routing constraints, or phase velocity mismatches due to inhomogeneous dielectrics with fiber-weave effect. Common mode noise results in...
In our previous study, we argued that stabilization of power source voltage by optimizing a chip wiring feature was essential to achieving high performance transmission for over 40 Gbps I/O on an interface circuit. This region frequency transmission approach is fairly important to solve communication bottleneck. We will examine power supply wiring for more high frequency (over 40 Gbps) which is significant...
This paper proposes an equivalent model of the coupling capacitance between TSVs and adjacent RDL. Based on the scalar potential integral equation and cylindrical accumulation mode basis functions, an efficient method of extracting the coupling capacitance is present. The scalability of the proposed model is verified by simulation and our results show that an accuracy of 10% is achieved from the analytic...
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