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A new sink should be in simple shapes for reasonable manufacturing process. On the other hand, the heat sink tends to be complicated shape for high cooling performance. Recently, 3D printer is able to process complicated shapes. However, manufacturing cost by 3D printing method is expensive. Thus it is important to verify and improve fluid flow and thermal conductivity at the design stage of the heat...
High thermal conductive adhesive is important to cool power devices. Recently thermal conductivity reaches more than 10W/mK by efficient addition of thermal conductive filler. However, high loading of filler makes the thermal conductive sheet poor adhesion. Furthermore, we focused on reducing an interfacial heat resistance between high thermal conductive sheet composed of resin and heat conductive...
Thermal dissipation phenomena have to be considered from various viewpoints of basic functions such as phonon drift, photon emission, mass transfer and potential transfer. At present, the phonon transfer and mass transfer issues are mainly simulated and analyzed, but they are not enough for the total analysis of thermal dissipation phenomena. Paul D. Franzon, North Carolina State Univ., often says...
In this paper, The relationship between the temperature rise of the heat generating components densely mounted in a grid pattern on the board and the various board design conditions was discussed. Based on the discussion, a simple estimation formula that can be used for temperature estimation for densely mounted components was derived.
This paper designs a System-in-Package (SiP) device with DSP + FPGA + ADC as the basic architecture. The diffusion thermal resistance model of SiP devices is established, which reduces the thermal resistance of the device by using special encapsulation materials and high heat transfer efficiency. At the same time, the temperature grade of SiP devices is improved. The laboratory temperature test shows...
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