The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Heat pipe is a best known passive cooling & heating device which is excellent in heat transfer and low thermal resistance. Basically, heat pipe is a two-phase heat transfer device using latent heat. Heat pipe is a device of very high thermal conductance and its equivalent thermal conductivity can be several hundred times higher than that of a solid copper rod of the same dimensions. Currently,...
Solder joint crack is increasing with increasing of warpage caused by larger Wafer Level Chip Size Package (WLCSP). Bump Support Film (BSF) were proposed as a protect material for preventing a solder joint crack of bumps. The BSF was constructed of a back grind tape and Bump Support Layer (BSL) which was composed of thermosetting epoxy resin. One of the key points of forming the BSL on a wafer which...
Cu to Cu bonding technology of IC package has the potential to replace solder joint in Future trends. The Cu to Cu bonding technology compared with other joint methods for IC package, it can solve the reliability problems such as electromigration, brittle intermetallic compound or other issues. At present, Cu to Cu bonding methods have been wide developed, but the microcosmic mechanisms of Cu to Cu...
In this study we investigated the effect of chemical etching process of a steel plate (SPCC) by phosphoric acid (H3PO4 aq. (10wt%) at 30–60°C for 300–1200s) on the surface morphology in order to enhance the welding strength of a carbon fiber reinforced thermoplastic (CFRTP) plate and the preprocessed SPCC plate joined by ultrasonic welding. As a steel plate was pre-processed, the open pores were obtained...
Utilizing hydrogen radicals as a reducing agent, reflow of indium solder paste printed on chips were conducted. Where hydrogen gas treatment failed to form indium solder bumps at 250 C, it was shown indium solder bumps were successfully formed at temperatures as low as 170 C.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.