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In order to improve tool productivity in semi-conductor manufacturing, we come up with this work reporting a combination of Wait Time Waste (WTW) and Hidden Capacity Diagnostic (HCD) analysis methodology to extract the wafer process information from tool log via SEMI standard and SECS data to do visualization analysis. Thereafter, it is easier to find opportunity to reduce unnecessary process waste...
Advanced process controls (APC) have been ubiquitously applied to the manufacturing processes of semiconductor devices for over two decades by now. Reports on its successful applications to the makings of light-emitting diodes (LED) in the solid-state lighting (SSL) industry however are comparatively less well documented in the literature [1-4]. The concluding remark in [1], ‘…APC is not yet reality...
The monitoring mechanism uses in-line data which is conservative stratification and grouping to calculation %Bias. (%Bias=bias/process variation.) It represents tools are significant difference when %Bias>10% referring to MSA 2nd manual. As each tool is too stable, the influence of variation would be so sensitive, and the mechanism would be too strict. We developed if we combined %Bias criteria...
Dual Port (DP) needs asynchronous clock skew test to screen out read-disturb-write during simultaneous row access from both ports. We will explain read-disturb-write failure mechanism from simulation and Si. The BL clamped design and longer write word-line-pulse scheme can improve DP Vmin. 2D adaptive shmoo is also proposed to reduce test time.
This paper introduces an integration method for a multi-type resource allocation problem (MRAP) and Product-mix scheduling problems (PMSPs) in real-time. Particularly, SAR2 (Simultaneous Allocation based on Resource-Ratio) is used as high-speed heuristic approach for the MRAP, and an real-time scheduling method using optimal production cycle (OPC) is used in the scheduling to maximize the resource...
A Critical Dimension SEM (CD-SEM: Critical Dimension Scanning Electron Microscope) is a dedicated system for measuring the dimensions of the fine patterns formed on a semiconductor wafer. CD-SEM is mainly used in the manufacturing lines of electronic devices of semiconductors. The measurement process includes OM Alignment, SEM Alignment, Addressing, Measurement, and Image Saved. From May 2015, we...
This paper discussed high-speed production scheduling for a high-mix low-volume (HMLV) production. A semiconductor wafer test process or assembly lines of electronic components are typical HMLV production systems in which several hundred products are produced in the same machine group at the same term (Week/Day). To improve the computational speed of Optimum Production Cycle (OPC) method for HMLV...
Most of simulation activities implemented on semiconductor manufacturing are focus on the device characteristics, and electrical properties. Less investigation pays attention on micro-structure stress/strain calculation with finite element analysis. This investigation demonstrates the ANSYS simulation results match with real cases results. The chip-level micro-structure simulations include the metal...
The need of isopropyl alcohol (IPA) for wafer drying has been increasing in the semiconductor industry, because the structure of semiconductor devices is getting more complicated and IPA drying is more preferable to avoid pattern disruption of complicated device structure. Also, as the feature size of the semiconductor devices continuously decreasing, the cleanliness level of IPA needs to be further...
A study of new RMS (Recipe Management System) design which is based on SEMI E170 SFORMS (Secured Foundation Of Recipe Management System) has been being done among Japanese device manufacturer, suppliers and system integrators. [1] This paper introduces the concept of SEMI E170 and reports current status of the study.
In PVD (Physical Vapor Deposition) process, this study mainly exhibits an innovatively designing approach of thin film micro-control which the Dummy Plate of Step type and the proportional of step structure (h/d) were optimized to attain reasonable Guard band. The optimized approach can effectively reduce the film deposition to avoid shell-like defect and significantly improve the effect of the crystal...
In October 2016, the IATF published a revised automotive industry standard, and the first edition will be referred to as “IATF 16949.” IATF 16949 is aligned with and refers to the most recent standard, ISO 9001:2015, fully respecting its structure and requirements. According to the IATF 16949, the goal of this standard is the development of a quality management system that provides for continual improvement,...
Machine learning has become a ubiquitous and essential part of business operations. Amazon uses algorithms to nudge their customers to purchase a product they might like. Given a purchase history for a customer and a large inventory of products, identify those products in which that customer will be interested and likely to purchase. A model of this decision process would allow a computer to make...
In order to increase bad wafer detection rate and reduce engineer trouble-shooting efforts, this work reports a combination of machine learning techniques to decode and extract the wafer map information from tool log via text mining, transform to useful virtual wafer images by image processing, auto wafer pattern classification by deep learning, and perform auto disposition (scrap, rework, add inspection,...
At Wafer Level Chip Scale Package, Every Sawn Wafers underwent Automatic Optical Inspection to ensure that all Dice affected by Mechanical Defect specifically Chippings will be screened-out effectively. An average of 151 defect per million of Chippings has been effectively screen-out at AOI process from WW07'15 to WW32'15.
The rapid pace of device scaling in recent years has outrun the ability of today's generation of equipment control systems to keep up. New device architectures and the materials and processes used to realize them create sources of variability that require better techniques for real-time sensing, filtering, detection, and response. This is not simply a question of faster data collection of the existing...
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