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This paper presents a real-time evaluation of power semiconductor devices in a high performance high power amplifier. The proposed method can represent the life status of the semiconductor modules in ‘odometer’ format. A special challenging case are pulsating load applications like an MRI gradient driver system. The general concepts presented have been evaluated in detail for the MRI case. A detailed...
In this paper, the effect of junction temperature swing duration on the lifetime of a transfer molded Intelligent Power IGBT Module is studied and a relevant lifetime factor is modeled. A temperature swing duration dependent lifetime factor is defined based on 38 accelerated power cycling test results under 6 different conditions and it may improve a lifetime model for lifetime prediction of IGBT...
In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first...
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