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In this paper, we take the typical LCCC electronic package structure as the research object, which is under the load of temperature cycle, and evaluate the thermal fatigue life of its solder joint based on the strain fatigue model and finite element method (FEM), and then predict its thermal fatigue life by using the engineering algorithm of electronic package structure. The results show that the...
This paper mainly studies T/R (Transmitter and Receiver) module in radar and its internal solid-state microwave power device, and the mechanisms of performance parameters' change affected by temperature. First, we establish a compact model of solid state microwave power FET (Field Effect Transistor). Second, based on the compact model, a behavioral model of T/R module is developed. By simulating the...
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