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A tomographic methodology for inspection of TSV (Through Silicon Via) process wafers is developed by utilizing an X-ray source. In conventional X-ray computed tomography (CT), the scanning axis of X-ray source and detector is approximately parallel to the long axis of the phantom and perpendicular to the plane of X-ray source. However, because TSV projection data are captured by angling the phantom...
As the rapid progress in the development of optoelectronic components and computational power, 3D optical metrology becomes more and more popular in manufacturing and quality control due to its flexibility and high speed. However, most of the optical metrology methods are limited to external surface. This paper proposed a new approach to measure tiny internal 3D surfaces with a scanning fiber endoscope...
Currently, thin films are widely used for the display product. Furthermore, the protective film is often attached to touch films and cover glasses for their safety. However, relatively few researches have been done for those products and there are many issues when we use current inspection system for multi-layered thin films. In this paper, we propose the novel method to inspect them based on 3d surface...
A control of degrees of freedom in the manipulation of light, including amplitude, phase and polarization is important for femto second laser processing with effective light-matter interactions. In this study, we demonstrate femto second laser processing with full control of phase distributions and polarization states of light by computer-generated holograms displayed on the spatial light modulators.
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