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In this paper three chipsets for mobile backhaul application in the V and E-band are presented. The chips are fabricated in a 170GHz fT SiGe production technology and housed in a wafer level package, eWLB. The three devices share the same silicon front-end. They show the same size, same architecture, and same pin interface. Thus, they enable cost efficient system designs from 57 up 86GHz. Moreover,...
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