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This paper presents new quantitative EMC (ElectroMagnetic Compatibility) design guidelines at board, cable and enclosure level to reduce radiated emission in the frequency range from 30 MHz to 6 GHz. These new design insights are the outcome of extensive 3D electromagnetic simulations on a general modelling framework for electrical architectures. They can be used during the early phases of system...
An equation-based method combing field equations with circuit solver is proposed for calculating electromagnetic susceptibility (EMS) on printed circuit board (PCB). These equations can be simplified to a voltage source and a current source, and then substituted into commercial software to calculate the impact of incident electromagnetic waves on traces on PCB. This paper compares the results calculated...
A simple and effective method to attenuate the propagation of switching noise within a power delivery network (PDN) on PCB-level is to use an electromagnetic band-gap structure (EBG). To determine the limit frequencies of the band-gap, an accurate model of the structure is necessary. This paper exploits the fact, that the patches of the EBG are electrically small at the frequency range below the band-gap...
Models for field-to-line coupling are interesting because they help to predict the immunity of PCBs and explain the relation between routing and immunity. In this article a meandered PCB trace illuminated by EM field in a TEM cell is analysed. The near-end and far-end coupling is predicted using two models: a detailed and an approximative one. The detailed model is a circuit of coupled multi-conductor...
Self-interference between digital interfaces and onboard wireless modules and antennas is rapidly becoming a major problem for Printed Circuit Board engineers. In this paper, the severity of on-board self-interference is quantified. Two working conditions are considered. First, the situation is considered in which the antenna is in receive mode. As the incoming (signal) fields are most often rather...
In this work a full-wave method based on the Mixed Potential Integral Equation technique is used to analyze the propagation in the time domain of a differential signal for a coupled microstrip structure with a metallic top cover. This top cover may be due to a dense circuit packaging or it can be intentionally added to enhance the immunity of the guiding structure. We study the impact of low-frequency...
A simple method based on equivalent dipole modeling is used to characterize the emissions from within a metallic enclosure with apertures. Planes surrounding the surfaces of this enclosure are modeled as 2D problems and then combined. This enables the shielding effectiveness of PCB enclosures or other electrical and electronic enclosures to be estimated.
A new test method has been implemented for testing the EMC performance of small components like small connectors and IC's, mainly used in mobile applications. The test method is based on the EMC-stripline method. Both emission and immunity can be tested up to 6GHz, based on good RF matching conditions and with high field strengths.
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