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One of the biggest design challenges today is to properly design, manufacture, simulate and validate a Power Distribution Network (PDN) in systems with increasing speed, power dissipation and density. PDN are typically comprised of capacitors networks that have several types of capacitors and values to obtain target impedance over the required frequency range for the power/ground planes on PCBs. Capacitors...
Surface mounted (SM) components are considered to be dominant in electronics technology. Fine pitch SM components are becoming common due to miniaturization tendencies. Ball Grid Array (BGA) components are classified as fine pitch, if the pitch is 1 mm (39 mil) or smaller [1]. These ICs desire careful approach in Printed Circuit Board (PCB) design. In order to compare the electrical performance of...
The paper presents the virtual and real investigations related to the fusing of PCB traces in high power applications. The reason of performing the research and related tests is that in real applications the current carrying capacity of PCB traces is different than the value presented in standards and datasheets or obtained after solving thermal equations. Based on the experimental results, the authors...
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