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An L-band gain and bandwidth tunable low-noise differential amplifier has been developed for the next generation reconfigurable wireless radios. It employs a varactor-tuned base bias circuit for tuning a lower band-edge frequency of the amplifier, a varactor-tuned collector bias circuit for tuning a higher band-edge frequency of the amplifier, an active load for a fine tuning of gain, and a cascode...
A fast clutter cancellation technique is proposed for quadrature Doppler radar to robustly detect the vital signals when clutters enter the test environment. The dc offset at baseband varies with the change of test environment, dramatically reducing the accuracy of vital signal detection. To solve this problem, a clutter cancellation generator is employed in the radar receiver. Based on the detected...
This paper presents a transformer-coupled resonator structure to integrate a balun into a bandpass filter using integrated passive device technology on glass substrate. The use of the transformer not only greatly reduces the size of the bandpass filter, but also easily provides the coupling to the balanced output ports. In addition, the tapped feed-lines are used to obtain a good impedance match at...
To achieve a squarewave output from a direct digital synthesizer (DDS) without analog signal processing, the lower order bits in the DDS accumulator are used to properly position the rising and falling edges of the accumulator most significant bit (MSB). A digital technique called “time filtering” is proposed to individually manipulate each rising and falling edge on the accumulator MSB. This technique...
This paper presents an RF MEMS tunable capacitor that achieves excellent power-handling property with relatively low actuation voltage. The tunable capacitor consists of two fixed MIM (Metal-Insulator-Metal) capacitors and two MEMS capacitor elements, all connected in series. This quadruple series capacitor (QSC) structure enables to reduce the actuation voltage without sacrificing the power-handling...
The high frequency (HF) crystal oscillator is susceptible to electromagnetic interference (EMI), which affects the stability or accuracy of reference frequency standards. The effect of radiated EMI can be both deterministic and random in nature that shows up as jitter in the time domain and phase noise in the frequency domain. In this paper, we studied the impact of radiated EMI in 155.6 MHz crystal...
This paper presents the design and realization of a compact phase shifter based on a tunable dual-mode ring resonator filter at 35 GHz. The tunability is achieved by employing a thin liquid crystal layer as a tunable dielectric substrate. By applying a bias voltage in the range of 0…40V, a tunable phase range of 117° is measured. The figure of merit of the realized phase shifter is 30.6 °/dB at 34...
The evolution of technologies is affected not only by direct technical needs but also by historical precedents. The direction of any technology is thus affected as much by its history as its science. In this paper, we examine how historical precedents in circuit simulation technology have, and will, motivate its future development.
Since the 1980s, NTT has been developing three- dimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful technique, especially at quasi-millimeter and millimeter wave. We describe the structure and features of 3D MMICs, introduce several MMIC subsystems, and point out future directions and plans for using 3D MMICs.
In this paper, we present a high-efficiency 400 W PA for a 6 MHz OFDM signal with a 10 dB peak-to-average power ratio (PAPR). To improve the efficiency of the PA at a 10 dB backoff from its saturated output power (PSAT), a dynamic drain voltage control is applied, which supplies two different drain voltages depending on the envelope of the OFDM signal. The PA is fabricated using a 400 W push-pull...
This paper presents a new design for a low cost, low complexity phased array. The proposed design allows control of the phase progression in the entire phased array by using only two phase shifters. As a result, cost and complexity of the phased arrays based on this approach can be significantly reduced. The proposed phased array is composed of directional couplers, amplifying stages, power combiners...
In this work, we propose a novel approach to adjust a dielectric constant using a magnetically aligned anisotropic conductive epoxy for microwave systems. The purpose of this approach is to produce large adjustability of dielectric constants by controlling the orientation of conductive particles using a magnetic technique in a viscous medium. In the experiment, we demonstrated that the dielectric...
A new topology for significantly improving the linearity of RF MEMS varactors is reported in this paper. A single MEMS varactor subject to a low frequency noise and/or modulating signal is the main structure under consideration. The key idea is to separate the single varactor into two varactors in parallel which are anti-biased. This leads to the opposing vibration of two beams under the influence...
In this paper we present a light weight broadband phased array hybrid receiver module on a multi-layer Liquid Crystal Polymer (LCP) substrate. The phased array module has 8 channels and is designed to operate in the Ka-band, from 32–37 GHz. A broadband linear tapered slot antenna array with a corporate power combiner, chip-on-board MMICs, and all control chips necessary for beam steering are all integrated...
This paper presents a new RF MEMS switch design which is capable of generating large forces under electrostatic actuation. The switch is 155×130 um^2, and results in 0.8–1.8 mN of contact force at 80–100 V, with a release force of 0.75 mN. The design is also highly insensitive to biaxial stress and to stress gradients. A prototype switch, fabricated on a high resistivity silicon substrates using an...
A flip chip single die WiFi FEM is developed using Bi-FET (HBT+E/D-PHEMT) technology for smart phone application. High thermal conductive copper-pillar bumps were developed for the flip chip process. This FEM flip chip die consists of a high-pass filter (HPF), a 2GHz WiFi PA with on-chip regulator, PAON logic and detector circuit, and an SP3T. It showed good over-voltage and over-temperature performance...
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