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Minimizing the thermal resistance of thermal interface material (TIM) bondlines is of interest to the electronics industry. The thermal interface material class examined in this study comprises epoxy based adhesives in which conductive filler particles are suspended. When used to assemble a thin bondline (on the order of two hundred microns or less) the apparent thermal conductivity of the bondline...
The presence of multiple thermally resistive layers in power electronics packages diminishes the enhanced convective benefit of high-performance microchannel cold plates. One improvement reported here is the development of stereolithographically defined aluminum nitride (AlN) microchannel integrated coldplates as substrates for power electronics packages. High-resolution fabrication of green ceramic...
This paper proposes a new effective thermal material simulation model as well as a non-destructive failure analysis for multi-layer substrates with thermal vias to derive exact failure data to supplement existing lifetime models. An effective thermal material simulation model is derived which is validated in simulation and experiment in transient mode. The modelling is done for a test matrix of representative...
We propose a new concept of mounting structure for high- temperature operable power semiconductor devices such as Silicon Carbide (SiC) or Gallium Nitride (GaN) with high reliability. The proposed structure is composed by high purity aluminum (Al) as a circuit metal on substrate and high- temperature resistant joint material as a chip joint layer. In this structure, the circuit metal can deform easily...
Understanding the adhesion between a micro/nano-size particle and a substrate is of both scientific and technological interest. Recently we developed a rolling resistance moment based particle adhesion characterization technique. The particle-substrate adhesion was deduced from the response of the adhered particle to a lateral pushing force. With a custom-made nanomanipulator, lateral pushing tests...
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