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In this research, we evaluate the potential for air cooling to meet the stringent cooling requirements of advanced automotive power electronics. We assess air cooling of power electronic components using laminar airflow micro-channel heat exchangers. Comparisons are made with ethylene glycol systems commonly used in tandem with engine cooling. Our analysis shows that despite a lower coefficient of...
Thermal control of power electronics cabinets requires thermal characterization under multiple length scales and transport modes. Detailed numerical calculations or measurements are often time consuming or simply unfeasible. An efficient multiscale thermal modeling methodology is proposed for electronic cabinets with hybrid liquid, forced air convection, and thermoelectric cooling. Compact models...
The presence of multiple thermally resistive layers in power electronics packages diminishes the enhanced convective benefit of high-performance microchannel cold plates. One improvement reported here is the development of stereolithographically defined aluminum nitride (AlN) microchannel integrated coldplates as substrates for power electronics packages. High-resolution fabrication of green ceramic...
A pressure atomized evaporative spray cooling nozzle array was used to thermally manage the power electronics of a 3 phase inverter module. The module tested was a COTS module manufactured by Semikron, Inc., and has a maximum DC power input of 180 kW (450 VDC and 400 A) with 25degC coolant. However, the standard heat sink that the module uses is a single phase liquid heat sink and when 100degC coolant...
Digitized heat transfer, or DHT, is a new technique for the thermal management of electronic devices where discrete droplets are used in place of continuous flows. This paper investigates the thermal management potential of a DHT system through the numerical solution of the mass, momentum, and energy equations of a simplified droplet travelling between heated parallel plates. The analysis shows much...
In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package. Reducing the thermal resistance of this thermal interface material (TIM) can help achieve the FreedomCAR program goals of using a glycol water mixture at 105degC or even...
In this paper, a novel heat sink with moving fins inserted between cooling fins is suggested for electronics cooling applications. In the novel heat sink, instead of the fan module, moving fins are inserted in the intervals of fixed fins (cooling fins) for generating fluid flow. By the relative motion of the moving fins to the cooling fins, heat dissipation from the cooling fins to the coolant and...
Sintered nanoscale silver paste was used as thermal interface material in an electronic package. Based on the microstructure of the sintered silver paste, die shear stress-strain curves and thermal cycling test results, a model combined with the model of Navarro-de los Rios and small cracks interaction physical model is put forward to predict the thermal fatigue lifetime of the sintered nanoscale...
As part of the U.S. Department of Energy (DOE) Advanced Power Electronics (APE) program, DOE's National Renewable Energy Laboratory (NREL) is currently leading a national effort to develop next-generation cooling technologies for hybrid vehicle electronics. Spray cooling has been identified as a potential solution that can dissipate 150- 200 W/cm2 while maintaining the chip temperature below 125degC...
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