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Chip-level heat flux levels have risen beyond 250 W/cm2 due to the presence of circuit architecture-driven hot-spots. After intense scrutiny over the past two decades, microchannel heat sinks are closer to commercial implementation as evidenced by the advent of the single-chip silicon cooler announced recently by IBM. Though there are a multitude of studies and data related to multichannel configurations,...
An innovative heat sink design aimed at meeting both the hotspot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes two separate, unmixed fluids to meet the cooling requirements of the chip with one fluid acting as a fluidic spreader dedicated to cooling the hotspots only, while the second fluid serves as both a coolant for...
Micropumps that can be directly integrated into microelectronic devices or microchannel heat sinks are of great interest due to performance, reliability, packaging and cost issues. One alternative is to generate the required flow directly in the microfluidic channels by inducing strong electromechanical forces in the fluid using integrated microelectrodes. In this work, a novel microfluidic pumping...
Small-scale refrigerators, termed mesoscalerefrigerators, are possible cooling solutions for high-power microelectronics. The performance of mesoscale refrigerators has not yet been experimentally demonstrated, although a recent theoretical model indicated that at temperatures near room temperature and above, a vapor compression refrigerator may compete successfully with a thermoelectric cooler having...
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