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Boiling heat transfer enhancement for a two-phase cooling design is presented in this paper. The paper discusses an effective method of boiling heat transfer enhancement and its performance. The pool boiling heat transfer from the silicon surface is enhanced by combination of surface modification and micro machined structure. The effect of micro structure features like pore diameter, pore pitch, channel...
The main purpose of the thermal interface material (TIM) is to conduct the heat from the die surface to the Ni finish Cu heat spreader. The key requirement for a reliable package is TIM thermal conductivity or thermal interfacial resistance and bond line thickness (BLT). Additional important parameters are modulus, ability to either be dispensed, low volume manufacturing (LVM) or screened, HVM (high...
INTRODUCTION Maintaining the integrity of the heat dissipation path for high end microelectronic devices has become increasingly challenging as the industry migrates from ceramic to organic packaging. Typically, flip chip organic packages undergo significant thermal and mechanical stresses throughout the manufacturing process, including chip join, underfill, encapsulation, BGA attach and card join...
With the relentless trend of increasing power and decreasing dimensions, thermal management of electronic packages is becoming a critical issue. Existing cooling techniques are fast becoming inadequate for the powerful electronic components expected in the near future. Researchers all over the world have been experimenting with advanced cooling techniques such as spray and impingement cooling using...
Thermal resistance is the most important parameter in package selection of high power devices. However, lower thermal resistances means higher package cost, so it is not easy to adopt high cost package like cavity down packages or flip-chip packages just for the thermal characteristics. Therefore, set-level thermal management and optimal thermal guide should be done before selecting thermally enhanced...
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In this work, the material behavior changes occurring in flip chip underfill encapsulants (silica...
Thermal cycling accelerated life testing is often used to qualify packages for various applications. Finite element life predictions for thermal cycling configurations is challenging due to the complicated temperature/time dependent constitutive relations and failure criteria needed for solders and encapsulants and their interfaces, aging/evolving material behavior (e.g. solders), difficulties in...
In flip-chip package, the mismatch of thermal expansion coefficients between the silicon die, copper heat spreader and packaging substrate induces concentrated stress field around the edges and corners of silicon die during assembly, testing and services. The concentrated stresses result in delamination on various interfaces involving a range of length scales from hundreds of nanometers to millimeters...
Thermal simulation had been conducted on flip chip packages with copper heat spreader and better thermal performance was achieved. The copper heat spreader was able to enhance the heat spreading from the die but thermal performance was affected due to the thin layer of thermal interface materials. It was observed that thermal performance gain can be as high as 30% from heat spreader. Ansys thermo-mechanical...
This paper addresses the reliability of flip-chip on flex (FCOF) assemblies glued with an Ag-particle filled anisotropic conductive adhesive (ACA). As the description of FCOF failure gives still much scope for speculation, a physics of failure based approach is developed here, taking into account the changing thermo-mechanical properties of the ACA under temperature and moisture. A failure hypothesis...
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