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The main purpose of the thermal interface material (TIM) is to conduct the heat from the die surface to the Ni finish Cu heat spreader. The key requirement for a reliable package is TIM thermal conductivity or thermal interfacial resistance and bond line thickness (BLT). Additional important parameters are modulus, ability to either be dispensed, low volume manufacturing (LVM) or screened, HVM (high...
In flip-chip package, the mismatch of thermal expansion coefficients between the silicon die, copper heat spreader and packaging substrate induces concentrated stress field around the edges and corners of silicon die during assembly, testing and services. The concentrated stresses result in delamination on various interfaces involving a range of length scales from hundreds of nanometers to millimeters...
Thermal simulation had been conducted on flip chip packages with copper heat spreader and better thermal performance was achieved. The copper heat spreader was able to enhance the heat spreading from the die but thermal performance was affected due to the thin layer of thermal interface materials. It was observed that thermal performance gain can be as high as 30% from heat spreader. Ansys thermo-mechanical...
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