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The objective of this paper is presenting two energy based failure criteria and applying them in reliability simulations of Complementary Metal Oxide Semiconductor (CMOS) structures. Of particular interest are the Back-End-Of-Line (BEOL) interconnect layers and their interfaces. It is an accepted fact that process-induced flaws due to a mismatch in the Coefficients of Thermal Expansion (CTE) of the...
For power devices, the reliability of thermal fatigue induced by power cycling has been prioritized as an important concern. Because, the power device like the converter system is the key in vehicle applications. So, high reliability is demanded by reduction in the size and high power capacity. Therefore shortening reliability evaluation is demanded using finite element method (FEM). Since power cycling...
In this work, free drop impact responses of printed circuit boards (PCBs) mounted in cellular phones has been investigated to assess their dynamic responses and investigate the effects of fastening methods. The digital image correction (DIC) method was used in order to measure a full-field deformation of PCBs during drop from a certain height. Three different fastening techniques which have point...
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