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A tube-type evaporator requires capillary force in order to lift liquid refrigerant to circumference direction under a gravity field, which reduces thermal performance. Therefore, a capillary pumped loop with a plate-type evaporator was newly manufactured to improve the performance and reduce the thickness of the evaporator. The plate-type evaporator is flat disk shaped with an effective diameter...
To address the thermal management challenges associated with high power dissipation devices, we describe a novel hybrid thermal management device, which enables significant enhancement of conventional air-cooled heat sinks using on- demand and spatially controlled droplet/jet impingement evaporative cooling. The device architecture modifies an air (gas)-cooled heat sink by adding a multiplexed, planar...
The fast development in semiconductor technology is leading to very high chip power dissipation and greater non- uniformity of on-chip power dissipation with the result of localized hot spots, often exceeding lkW/cm2 in heat flux, which can degrade the microelectronics performance and reliability. Thin and very thin liquid films driven by a forced gas/vapor flow (stratified or annular flows), i.e...
Many factors, such as acoustic noise limits and fan reliability considerations, limit the heat dissipation capacity of air-cooled cabinets housing telecommunications or computing hardware. The present work examines the potential of enhanced cooling in a sealed telecommunications cabinet using an evaporating- condensing dielectric mist introduced upstream of heat sinks attached to high-power components...
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