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Hot spots on thin wafers of IC packages are becoming an important issue in thermal and electrical engineering. To investigate these hot spots, we developed a diode temperature sensor array (DTSA) that consists of an array of 32 times 32 diodes (1,024 diodes) in an 8 mm x 8 mm surface area. We used chemical-mechanical planarization to make DTSA chips with various thicknesses (21.5 mum, 31 mum, 42 mum,...
An innovative heat sink design aimed at meeting both the hotspot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes two separate, unmixed fluids to meet the cooling requirements of the chip with one fluid acting as a fluidic spreader dedicated to cooling the hotspots only, while the second fluid serves as both a coolant for...
This paper describes the phase growth of Sn-3.0Ag- 0.5Cu solder joints by mechanical cyclic loading. The objective of this paper is to clear the influence of temperature and strain to the phase growth. It is very important to evaluate the life time of crack initiation in Sn-3.0Ag-0.5Cu solder joints under thermal cycles. A mini-lap joint type shear specimen was used to evaluate the influence of temperature...
In this paper, principal component regression models (PCR) have been investigated for reliability prediction and part selection of area package architectures under thermo- mechanical loads in conjunction with stepwise regression methods. Package architectures studied include, BGA packages mounted on CU-CORE and NO-CORE printed circuit assemblies in harsh environments. The models have been developed...
Thermal management of device level packaging continues to present many technical challenges. In the typical chip heat sink assembly, the highest resistance to heat flow comes from the thermal interface material (TIM). The thermal conductivities of TIMs remain in the range of 1-4 W/mK due to the properties and structure of small dispersed solids in polymer matrices. As a result of the rising design...
The power dissipated by electronic components has been steadily increasing, but financial and form factor restrictions exist on the cooling solution and the pressure is on to improve the power dissipation capability. The main parameter used for designing a component's cooling system is known as Thermal Design Power (TDP). This parameter is used as a steady state power target that the cooling solution...
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