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This paper is a follow-up of a hard disk drive study presented at ITherm 2006 on thermal-acoustic optimization of a HDD placed inside an air duct with an axial fan. Today we present a benchmark study performed on a number of consumer products containing a HDD. We will show that it is possible to predict if a certain application design is close to its optimal, set-level design. This is important for...
Power dissipation levels in mobile electronics devices are heading towards five watts and above. With this power dissipation level, products such as mobile phones will require active cooling to ensure that the devices operate within an acceptable temperature envelop from both user comfort and reliability perspectives. To the authors knowledge no studies to date have been carried out to determine the...
Rapid development in the design of electronic packages for modern high-speed computers has led to the demand for effective methods of chip cooling. The primary concerns in thermal management applications are high thermal conductivity, large specific surface area and low weight. Graphite foams which possess predominantly spherical pores with smaller openings between the cells constitute a novel highly-conductive...
Porous metal foams, inserted into the channels of a liquid cold plate, can be used to enhance forced convection and flow boiling heat transfer and may be especially useful for direct, dielectric liquid cooling of electronic and photonic components. This study explores the thermofiuid characteristics of three porous copper foam configurations: 95% porosity and 10 PPI, 95% porosity and 20 PPI, and 92%...
Thermal control of power electronics cabinets requires thermal characterization under multiple length scales and transport modes. Detailed numerical calculations or measurements are often time consuming or simply unfeasible. An efficient multiscale thermal modeling methodology is proposed for electronic cabinets with hybrid liquid, forced air convection, and thermoelectric cooling. Compact models...
In high power electronics applications, the most preferred way of thermal management is the use of a heat sink and a fan for active cooling. Though this thermal solution is fairly adequate for the current heat dissipation needs, it suffers from some serious limitations, which may tend to limit its use with time. In the present study, we quantify the limitations of a conventional fan-cooled heat sink...
As portable platforms including laptops, handheld PCs, and similar handheld electronics become more powerful and more popular, they present unique thermal management challenges. In the past, most thermal management solutions have dealt with directly cooling the microprocessor by way of a heat spreader, heat sink, and fan. However, the microprocessor thermal solution does not cool all areas of the...
Nano fluids are colloidal solutions which contain a small volume fraction of suspended submicron particles or fibers in heat transfer liquids, such as water or glycol mixtures. Compared with the base fluid, numerous experiments have generally indicated an increase in effective thermal conductivity and a strong temperature dependence of the static effective thermal conductivity. However, in practical...
Microgap coolers provide direct contact between chemically inert, dielectric fluids and the back surface of an active electronic component, thus eliminating the significant interface thermal resistance associated with thermal interface materials and/or solid-solid contact between the component and a microchannel cold plate. This study focuses on the two-phase thermo-fluid characteristics of a dielectric...
The heat removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant. Correlation-based predictions and computational fluid dynamic modeling of cross-flow heat-removal structures show that the coolant temperature increase due to sensible heat absorption limits the cooling performance...
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