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Boiling heat transfer enhancement for a two-phase cooling design is presented in this paper. The paper discusses an effective method of boiling heat transfer enhancement and its performance. The pool boiling heat transfer from the silicon surface is enhanced by combination of surface modification and micro machined structure. The effect of micro structure features like pore diameter, pore pitch, channel...
For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 W/cm2 in the near future. Direct and indirect low temperature refrigeration cooling facilitate appreciable reduction in...
Recent studies provide ample evidence of the effectiveness of two-phase spray cooling at dissipating large heat fluxes from electronic devices. However, those same studies point to the difficulty predicting spray performance, given the large number of parameters that influence spray behavior. This paper provides a complete set of models/correlations that are required for designing an optimum spray...
The fast development in semiconductor technology is leading to very high chip power dissipation and greater non- uniformity of on-chip power dissipation with the result of localized hot spots, often exceeding lkW/cm2 in heat flux, which can degrade the microelectronics performance and reliability. Thin and very thin liquid films driven by a forced gas/vapor flow (stratified or annular flows), i.e...
Large density differences between liquid and vapor create buoyancy effects in the presence of a gravitational field. Such effects can play an important role in two-phase fluid flow and heat transfer, especially critical heat flux (CHF). CHF poses significant risk to electronic devices, and the ability to predict its magnitude is crucial to both the safety and reliability of these devices. Variations...
This study examines the heat transfer enhancement attributes of carbon nanotubes (CNTs) applied to the bottom wall of a shallow rectangular micro-channel. Using deionized water as working fluid, experiments were performed with both a bare copper bottom wall and a CNT-coated copper wall. Boiling curves were generated for both walls, aided by high-speed video analysis of interfacial features. CNT arrays...
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