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In this paper, a mathematical approach for interrogation of system state under cyclic thermo-mechanical stresses has been developed for 6-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, SnlAg0.5Cu, Sn3Ag0.5Cu, Sn4Ag0.5Cu second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology presented...
To meet electrical performance requirements, the industry is implementing ultra-low dielectric constant (ULK) materials in the back end of line interconnect structure. ULK dielectrics are inherently weak compared to traditional dielectrics and pose significant challenges to electronic packaging processes and reliability. Accurate mechanical properties are a prerequisite for upfront risk assessments...
In this work, free drop impact responses of printed circuit boards (PCBs) mounted in cellular phones has been investigated to assess their dynamic responses and investigate the effects of fastening methods. The digital image correction (DIC) method was used in order to measure a full-field deformation of PCBs during drop from a certain height. Three different fastening techniques which have point...
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