The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This article deals with performance of 3D-IC which is influenced by thermal effects as well as 3D packaging and parasitic effects. Actual circuit performance is difficult to predict as thermal and 3D packaging effects act in opposite ways. To provide design insight, a stacked wafer 3D-SOI technology was characterized and a thermal model was developed. Electro-thermal simulations of 3D-ICs were performed,...
The rising integration level of mixed-signal integrated circuits raises new issues for designers. Substrate noise generated by the switching digital part has a detrimental impact on the performance of the analog/RF parts. This contribution introduces simulation and experimental characterization of so-called "digital substrate noise" on a 0.13-mum SOI CMOS process with high resistivity (HR)...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.