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This paper introduces a novel wafer-level hermetic packaging technology for MEMS based on Cu/Sn isothermal solidification (IS) technology. We designed the structure of the intermediate multilayer and the pattern of sealing rings, optimized the bonding process, and analyzed some key factors affecting the hermeticity, such as the dimension of the sealing rings. Successful Cu/Sn IS bonding was realized...
In recent years, interest in the thermal-hydraulics at micro/nano scale keeps increasingly growing owning to the rapid technology thus enabled. It was now accepted that the classical thermal or fluidic theories working well for "macro bulk systems" may become invalid for micro/nano scale geometry. On the contrary, some phenomena seldom occur in the large scale may frequently happen as a...
In this paper, the CFD approach is used to simulate the thermal behavior in an electromagnetically driven microgyroscope. The driving wires, in which the alternating current flows, are treated as the heat sources. For a glass-silicon-glass device structure, it is found that the differences of the temperature, pressure and velocity along the driving direction surrounding the proof masses increase as...
Based on self-scrolling of Si/Cr bilayer films on Si(001) wafers, various micro- and nanostructures including micro-claws, microtubes, helical nanobelts, nanorings and nanospirals are fabricated in a controllable way. The scrolling principles of the structures from Si/Cr bilayer films are discussed. The flexibility of individual Si/Cr nanospirals and nanorings has been investigated using a nanorobotic...
This paper reports the development of a polycrystalline diamond (poly-C) thin film encapsulation packaging process which is integrated into the MEMS cantilever resonator fabrication. The high Young's modulus and chemical stability of poly-C make it an excellent candidate material for a thin film package. A test chip is fabricated using a 4-mask process. First, poly-C cantilever beam resonator is fabricated...
This paper presents a novel channel fabrication technology of monolithic bulk-micromachined embedded channels. Based upon implementing two-step complementary dry etching technique and conformal parylene C layer deposition, high-aspect-ratio (internal channel height/internal channel width, greater than 20) polymer channels with uniform quasi-rectangular sidewalls have been successfully fabricated in...
Piezoelectric material plays an important role in the extensive applications of microelectromechanical systems (MEMS). However, its thick-film fabrication process is still not well-established along with the MEMS development. Here we develop a thick-film microfabrication process specifically for the lead-zirconate-titanate (PZT) piezoelectric material. The growth of thick PZT film is facilitated by...
The latest generation of gigahertz-clock-rate CPUs is becoming more challenging to fit into designs. These chips are squeezing into tighter and tighter spaces with no enough places for heat to dissipate. Meanwhile, high-capacity cooling options remain limited for many small-scale applications such as microsystems, sensors and actuators, and micro/nano electronic components. This work presents a MEMS...
Grating moving light modulator, a MEMS-based movable diffraction grating with electrostatic actuation, can be used for projection displays and relevant applications, its dominant power exchange is between the 0th and plusmn1st order by modulating phase of incident light, two optical collecting systems based on 0th, plusmn1st order operation are designed and analyzed with Fraunhofer diffraction theory...
Ferromagnetic sensors and actuators have been extensively studied on the microscale and have led to the development of optical switches [Judy, JW & Muller, RS, 1997], magnetically-tunable frequency-selective surfaces [Zendejas, J, et al., 2002], magnetic assembly of out-of-plane-MEMS devices [Chen, J, et al., 2001], and low-power to zero-power magnetometers [Yang, HH, et al., 2002; Vasquez, DJ...
To relieve the residual stress in small assembly, a method called high-frequency vibratory stress relief was researched. Microscopic origin of residual stress was analyzed according to the theory of crystal dislocation, which shows that the appeared unstable dislocations and localized energy concentrating are the main reason to produce residual stress. And then the mechanism of high frequency vibratory...
Through studying the micropump and microvalve used in microfluidic control chemical analysis from the design of structure, working principle and fabrication process, a novel PZT-driven micropump was developed. The construction and the fabrication process are quite simple. It consists of flexible PDMS pump diaphragm, base plate and piezo-bimorph actuator. Diaphragm, meanwhile, is an active valve whose...
In this paper, a novel silicon micromachining using CO2 laser has been demonstrated for the first time. The wavelength of CO2 laser is 10.64 mum and not absorbed by silicon material. So, it cannot do any micromachining for pure silicon. However, as we put a silicon on the top of a glass material, CO2 laser can etch the silicon, even etch through the wafer to be a hole structure. For example, a silicon...
In this paper, we propose a novel method to fabricate three-dimensional hexagonal-like fillister structures on lang110rang silicon wafer by precise bulk etching in micro electro mechanical systems (MEMS). Photo mask is designed as a 50 times 50 array of equilateral parallelograms having side length of 80 mum. The 40 wt% KOH solution is used as the etchant. The created structure is used as the mold...
In recent years, high resolution metrology up to nano-scale has attracted substantial attention due to the increasing need of ultra precision measurement systems for MEMS and NEMS calibration. In this paper, an analytical and numerical investigation for the proposed design of a 6-degree-of-freedom (6-dof) universal ultra precision metrology system using relatively simple and inexpensive but highly...
Novel local curvature test structures combined with a sub-nanometer optical interferometry measuring setup have been developed to detect stresses in nanometer-scale films as well as ultra low stresses in thin films. Stress difference as small as 1.5 MPa within a 30 nm film can be resolved with this metrology, which is among the best in the present reports. Residual stresses in thermal SiO2 and LPCVD...
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