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In this paper the thermal conductivities of monocrystal carbon, silicon, and germanium nanometer thin film are simulated respectively using non-equilibrium molecular dynamics (NEMD) method and corresponding Tersoff potential energy function. The simulation results indicate that the thermal conductivities of those nanometer thin films are obviously lower than the corresponding thermal conductivities...
A comparative study of the micro-tribological properties of silicon-based component and octadecyltrichlorosilane (OTS) molecular lubricant film which was prepared on Si(100) substrate, and their adhesive and tribological properties were mainly investigated by AFM/LFM. Meanwhile, the effect of relative humidity and scanning velocity was taken into consideration. The results show that the adhesive force...
In this paper, a self-aligned SiGe/Si HBT was fabricated based on dry/wet etching, in which Si and SiGe materials were etched by KOH (potassium hydroxide) solution and SF6 (sulfur hexafluoride). In the terms of mesa SiGe HBT production, it is a key technology to control the etch of ultra-thin Si and SiGe film. When N+/N silicon in emitter region is etched, the length of etch time is critical. If etch...
This paper presents a nano-roughening technique to effectively modify bonding surface for ensuring for the continuation of hermetic encapsulation shrinkage from MEMS to NEMS. The roughening is realized via a non-uniform etch characteristic of PR which is etched then utilized as an etching mask for the following silicon etching process. UV adhesive bonding is utilized for the verification of the nano-roughening...
This paper presents the design, simulation, fabrication and preliminary test results of a monolithic triaxial micromachined vibratory gyroscope. The device is a monolithic integration of two uniaxial in-plane (x- and y-axis) gyroscopes and one uniaxial out-of-plane (z-axis) gyroscope and the three individual gyroscopes are all actuated by electrostatic force and detected by capacitors. In order to...
It has been widely accepted that the threshold of surface roughness for low temperature hydrophilic wafer bonding is 0.5nm. However, we have proven that wafers with higher surface roughness can be bonded. By the aid of proper contact pressure, we have bonded the wafers with roughness of 1.0nm successfully and found that thinner wafers were easier to be bonded than thick ones whereas wafers with thickness...
Low-energy electron-beam (e-beam) lithography using ZEP-520 as a positive resist has been investigated in the energy range between 0.5 and 20 keV. The interaction between electrons and ZEP-520 resist, and its effect on the exposure dose and the penetration depth of the electrons have been studied as a function of electron energy. At 10 keV ~ 20 keV energy, we were able to achieve line gratings of...
Macroporous silicon technology is an important method to fabricate microchannels on silicon. The formation of insulator layer on the sidewall of the channels is necessary for electrical isolation or passivation of the surface. Oxidation is one of the preferred options. In this paper we investigate the effect of various oxidation processes on the smoothness of the sidewalls of the high aspect ratio...
Silicon nanostructures were fabricated by a natural lithography technique, with sizes far beyond the limit of conventional, by a self-organizing gold colloidal particle monolayer as an etch mask. The silicon nanostructures with high density and uniformity in height and shape were obtained using reactive ion etching (RIE). The uniform spatial distribution of the Si nanostructures can also be obtained...
Silicon-based MEMS techniques are very popular for the manufacture of micro parts. Only a limited number of materials can be processed by these techniques. As the rapid development of Selective Laser Sintering(SLS) in laser rapid prototyping field almost any material can be used. Laser Micro Sintering(LMS) was recently introduced in the fabrication of 3D MEMS parts. The main difference between SLS...
This paper presents the optimized design of a novel Focal Plane Array (FPA) structure for opt-mechanical uncooled infrared imaging system. The FPA structure is a bi-material micro-cantilever array which without Si substrate and with thermal isolation organ. In the paper, we build up series of model to describe the structure's IR absorb, heat exchange and thermal-mechanical characters. To optimize...
The paper proposes a novel design concept and fabrication method of micro dispensing chip. The filling process is performed by capillary force without extra energy, greatly reducing the complexity of design and operation. The annular interspaces around the nozzles in the chip can help the droplet formation on the hydrophilic surfaces, and the step conjunction between the channel and the reservoir...
Two-phase convective flow in micro channels has numerous promising applications such as electronic cooling. This study investigates evaporation phenomena and capillary-driven heat in a rectangular micro channels structure with hydraulic diameters of 100 ~ 250nm and length of 75mm. The micro channels made of (110)-orientated silicon is fabricated by bulk micromachining. The temperature distributions...
The solid phase epitaxial regrowth of structurally modified amorphous silicon created by self-ion implantation into nanovoided crystalline silicon is investigated. It is demonstrated that although the modified amorphous silicon is fully reconstructed into single crystal during the epitaxial regrowth, both activation energy and atom attempt frequency for the regrowth are much higher than those of the...
This paper reports a bulk Si micromachined distributed digital microwave phase shifter with butterfly-like loading microbridges. Having a multilayer structure, the bridges use heavily boron-doped single crystal silicon (SCS) as the skeleton layer, so that the excellent mechanical property of SCS can be utilized to ensure the performance and reliability of the device. The fabrication is shown to be...
The squeeze film damping effect generating from the sealed air gap between a vibrating circular thin plate and a fixed substrate is analyzed in this paper. Both the Bessel series technique and the Rayleigh-Ritz energy method are utilized to investigate the gas damping effect on the micro airflow in a sealed chamber. The air pressure distribution of the squeeze film air damping is determined by solving...
A new method for realization of 3D multilayer micro structures is presented in this paper. It consists of two major processes: silicon etching process and UV-LIGA process. In this way, some shape limitations of single technology can be overcome for new functions. By combining these processes, multilayer structures and complex graphics can be fabricated. To make good combination, the adhesive characteristics...
This paper reports the theory, fabrication and testing of a novel uncooled infrared (IR) sensor using amorphous silicon thin film transistors (a-Si TFTs) as the active elements. The measured temperature coefficient of the channel current (TCC) of the a-Si TFT is about 4.18%/K at room temperature. What's more, finger-cross TFT is designed, which can greatly improve the detectivity of uncooled infrared...
For better understanding of the essential removal mechanisms of brittle material and stress distribution at high speed and ultrasonic elliptical vibration assisted cutting conditions at the atomic level, the single crystal silicon, expected as a next generation semiconductor material for wide band cap, high-voltage and low-loss power devices, MEMS components and so on, is analyzed by molecular dynamics...
In this paper, a MEMS method is developed to form suspended nano beams in 10 nm order width and thickness. The dimension of the nano beams is controlled precisely by employing traditional anisotropic self stopping etching instead of popular nano fabrication method such as e-beam lithography, which presents an opportunity for the future low cost batch product. The I-V measurements indicate that the...
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