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Plastic ball grid array packages (Sn3.0Ag0.5Cu) were assembled with Sn3.0Ag0.5Cu and Sn37Pb solder paste to form Pb-free and mixed BGA assemblies. The Pb-free and mixed assemblies were subjected to one (1X) rework cycle and three (3X) rework cycles. All the reworked Pb-free and mixed assemblies were then subjected to a temperature cycling test with a temperature range of -55°C-125°C. The cycles to...
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