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Low microwave noise performance of AlGaN/GaN HEMTs fabricated on MOCVD epitaxial structures grown on composite substrates (SiCopSiC) is reported. They are made of a thin SiC single-crystal layer transferred on top of a thick polycrystalline SiC wafer. The transistor fabrication process is similar to the one developed for AlGaN/GaN devices on SiC substrate. A minimum noise figure of 0.12 dB with an...
A simple method is reported for fabrication of AlN/GaN MOS-HEMTs. Ultra-thin Al2O3, which is formed using thermal oxidation of evaporated Al, was used for surface passivation and as a gate dielectric. Prior to formation of Al2O3, the Al protects the very sensitive AlN epilayer from exposure to processing liquid chemicals. Fabricated two-finger AlN/GaN MOS-HEMTs with 3 m gate length and 200 m gate...
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