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This letter presents a wafer-level approach for producing rollable single-crystal silicon integrated circuit (IC) wafers, bent with a 17-mm minimum radius of curvature, achieved by backside nanotexturing. The three-point bending test indicates a mechanical strength enhancement by a factor of 2.3 for nanotextured 60-$\mu \text{m}$ thick samples. The minimum radius of curvature decreased by 43.4%,...
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