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Wave soldering is one of the most widely used soldering methods in the electronics industry. However there are many influences that caused to soldering failure. This article presents a typical case about poor vertical fill failure analysis during wave soldering. Base on a series analysis, such as surface element detected, vertical cross section, thickness of inter-metallic compound (IMC) measurement,...
Function failure was found successively in one type of smart remote controls when using a period of time. With preliminary investigation by electric circuit, low resistance was found between the neighboring pins on failure sample which connected with flexible printed board and rigid printed board, but the pins on good sample were insulated with the others. After peeling off the flexible printed board,...
With the decrease in the overall size and the rapid increase in the working frequencies of printed circuit boards, the reliability of solder joints, especially the high frequency signal transmission reliability has become the key factor in system reliability. In this paper, changes in RF impedance of solder joints in a temperature cycling environment was studied using time-domain reflectometry measurements...
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