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Maintaining the insulation between adjacent electrical interconnections is critical for the success of active implantable medical device. Underfilling and globtop coating of dense arrays of microfabricated interconnects pose a big reliability risk. Contamination, voids and the difficulty to deposit liquid underfillers with the appropriate adhesive behavior remains a major hurdle when developing miniaturized...
Long-term stability of neural interfaces is a challenge that has still to be overcome. In this study, we manufactured a highly stable multi-layer thin-film class of carbon-based devices for electrocorticography (ECoG) incorporating silicon carbide (SiC) and amorphous carbon (DLC) as adhesion promoters between glassy carbon (GC) electrodes and polyimide (PI) substrate and between PI and platinum (Pt)...
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